Journal Articles
IEEE Transactions on Components and Packaging Technologies
Year : 2007
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https://centralesupelec.hal.science/hal-00320362
Submitted on : Wednesday, September 10, 2008-5:32:31 PM
Last modification on : Friday, March 24, 2023-2:52:50 PM
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- HAL Id : hal-00320362 , version 1
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Arnaud Monnier, B. Froidurot, C. Jarrige, René Meyer, Philippe Testé. A mechanical, electrical, thermal coupled-field simulation of a sphere-plane electrical contact. IEEE Transactions on Components and Packaging Technologies, 2007, 30, pp.787-795. ⟨hal-00320362⟩
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