Study of thin underlayers to hinder contact resistance increase due to intermetallic compound formation - CentraleSupélec Access content directly
Conference Papers Year : 2009

Study of thin underlayers to hinder contact resistance increase due to intermetallic compound formation

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hal-00445406 , version 1 (08-01-2010)

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  • HAL Id : hal-00445406 , version 1

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Sophie Noël, David Alamarguy, Sandra Correia, P. Gendre. Study of thin underlayers to hinder contact resistance increase due to intermetallic compound formation. 55th IEEE Holm Conference on Electrical Contacts, Sep 2009, Vancouver, Canada. pp. 153-159. ⟨hal-00445406⟩
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