Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies - CentraleSupélec
Journal Articles Procedia Engineering Year : 2010

Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies

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Mechanics of materials [physics.class-ph] Mechanics of materials [physics.class-ph]

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https://centralesupelec.hal.science/hal-00761224

Submitted on : Wednesday, December 5, 2012-10:33:53 AM

Last modification on : Tuesday, June 4, 2024-1:36:03 PM

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hal-00761224 , version 1 (05-12-2012)

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Benoît Dompierre, Véronique Aubin, Eric Charkaluk, Wilson Carlos Maia Filho, Michel Brizoux. Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies. Procedia Engineering, 2010, 2 (1), pp.1477-1486. ⟨10.1016/j.proeng.2010.03.159⟩. ⟨hal-00761224⟩

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