Tiny companion testchip for 56 Gbaud applications based on microring resonators
Résumé
Objective: To address 56G external I/Os issues • Purpose: IP core for customer at packaging level • Tiny and configurable companion testchips • 3D assembly validation • Passive & active components of PIC25G + BiCMOS/CMOS Thesis schedule: Dynamic testchip at wafer-level with 3D assembly • CMOS driver in B55 at 10-25 Gbps • Ring resonator modeling • Qualification testchips based on microring resonators for 56 Gbps applications
Domaines
| Origine | Fichiers produits par l'(les) auteur(s) |
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