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Conference Papers Year : 2017

Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator

Abstract

This paper presents the impact of 3D assembly on a silicon ring resonator. Indeed, the flip-chip integration used to connect photonic and electronic circuits requires high temperatures processes. The cooling of such a structure induces thermo-mechanical stresses on silicon waveguides. A finite element modelling is proposed to theoretically quantify the stress distribution. The photo-elastic effect is then highlighted to explain the change in silicon refractive index. As a result, the ring resonance wavelength is shifted from approximately 100 pm. Performance of a WDM (wavelength division multiplexing) system could thus be highly degraded.
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Dates and versions

hal-01535044 , version 1 (08-06-2017)

Identifiers

  • HAL Id : hal-01535044 , version 1

Cite

Audrey Michard, Nicolas Michit, Jean-Baptiste Quelene, Jean-François Carpentier, Pietro Maris Ferreira. Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator. 19th European Conference on Integrated Optics (ECIO), Apr 2017, Eindhoven, Netherlands. ⟨hal-01535044⟩
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