%0 Conference Proceedings %T Full-wave model of 3D scattering by a fibered laminate %+ School of Electronics and Information, Northwestern Polytechnical University %+ Laboratoire des signaux et systèmes (L2S) %+ Institution of High Performance Computing, A*STAR (IHPC) %+ Chaire Modélisation, Caractérisation et Maîtrise des expositions aux ondes électromagnétiques (C2M) %A Li, Changyou %A Lesselier, Dominique %A Zhong, Yu %A Liu, Zicheng %Z 3 pp %< avec comité de lecture %B 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT 2018) %C Chengdu, China %I IEEE %3 Proc. 10th International Conference on Microwave and Millimeter Wave Technology (ICMMT 2018), IEEE Xplore %P 18321903 %8 2018-05-07 %D 2018 %R 10.1109/ICMMT.2018.8563533 %K scattering matrix %K mode-matching method %K fiber-reinforced composites %K Plane wave scattering %Z Engineering Sciences [physics]/Electromagnetism %Z Engineering Sciences [physics]/Optics / Photonic %Z Mathematics [math]/Mathematical Physics [math-ph]Conference papers %X A full-wave computational model for electromagneticscattering of conically incident plane waves with arbitrarypolarization is proposed for a multilayered structure (laminate)made of dielectric slabs wherein periodically arranged circularcylinders are embedded. An electric field is considered as theincident wave with arbitrary polarization. The magnetic fieldproduced by the incident wave is obtained with Maxwell’s equations.Both the transverse electric and magnetic field componentsare used for mode-matching at the boundary for calculating thescattering matrices. Power reflection and transmission coefficientsfollow from Poynting’s theorem. This work is a first step towardthe Green’s function of the structure, in view of imaging apossibly damaged laminate %G English %L hal-01728703 %U https://centralesupelec.hal.science/hal-01728703 %~ INSTITUT-TELECOM %~ CNRS %~ UNIV-PSUD %~ ENST %~ SUP_LSS %~ INSMI %~ TELECOM-PARISTECH %~ PARISTECH %~ SUP_SIGNAUX %~ CENTRALESUPELEC %~ TDS-MACS %~ UNIV-PARIS-SACLAY %~ UNIV-PSUD-SACLAY %~ TELECOM-PARISTECH-SACLAY %~ CENTRALESUPELEC-SACLAY %~ INSTITUTS-TELECOM %~ GS-ENGINEERING %~ GS-COMPUTER-SCIENCE