Journal Articles Microelectronics Reliability Year : 2010

Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy

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Mechanics of materials [physics.class-ph] Mechanics of materials [physics.class-ph]

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https://centralesupelec.hal.science/hal-00761246

Submitted on : Wednesday, December 5, 2012-10:47:48 AM

Last modification on : Tuesday, June 4, 2024-1:36:03 PM

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hal-00761246 , version 1 (05-12-2012)

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Benoît Dompierre, Wilson Carlos Maia Filho, Michel Brizoux, Véronique Aubin, Eric Charkaluk. Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy. Microelectronics Reliability, 2010, 50 (9-11), pp.1661-1665. ⟨10.1016/j.microrel.2010.07.125⟩. ⟨hal-00761246⟩

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