Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy - CentraleSupélec Access content directly
Journal Articles Microelectronics Reliability Year : 2010

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hal-00761246 , version 1 (05-12-2012)

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Benoît Dompierre, Wilson Carlos Maia Filho, Michel Brizoux, Véronique Aubin, Eric Charkaluk. Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy. Microelectronics Reliability, 2010, 50 (9-11), pp.1661-1665. ⟨10.1016/j.microrel.2010.07.125⟩. ⟨hal-00761246⟩
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