Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates - CentraleSupélec Access content directly
Conference Papers Year : 2018
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hal-01834171 , version 1 (10-07-2018)

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  • HAL Id : hal-01834171 , version 1

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Shuangfeng Zhang, Eric Labouré, Denis Labrousse, Stéphane Lefebvre. Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates. Power Conversion and Intelligent Motion (PCIM) Europe, Jun 2018, Nuremberg, Germany. ⟨hal-01834171⟩
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